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Thermal Grizzly Hydronaut – 1g

 1,999

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  • Thermal Resistance: 0.0076K/W
  • Electrical Conductivity: 0 hp/m
  • Viscosity: 140-190 pas
  • Density: 2.6g/cm3
  • Temperature: -200°C / +350°C
  • Contents: 1g

Description

With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water-cooling system, for example.

  • Suitable for Overclocking
  • Excellent Thermal Conductivity
  • No Curing
  • Silicone Free
  • Not Electrically Conductive

The Hydronaut Paste offers optimal thermal conductivity for large-area heat carriers, which are particularly found in the water-cooling sector.

The Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage that it has a very low weight and high flexibility, which means that the thermal paste can be applied very easily.

Hydronaut achieves the best values ​​for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.

Technical Specifications

  • Thermal Resistance: 0.0076K/W
  • Electrical Conductivity: 0 hp/m
  • Viscosity: 140-190 pas
  • Density: 2.6g/cm3
  • Temperature: -200°C / +350°C
  • Contents: 1g

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