Description
With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price/performance ratio for their water-cooling system, for example.
- Suitable for Overclocking
- Excellent Thermal Conductivity
- No Curing
- Silicone Free
- Not Electrically Conductive
The Hydronaut Paste offers optimal thermal conductivity for large-area heat carriers, which are particularly found in the water-cooling sector.
The Hydronaut thermal compound has a silicone-free carrier structure. This has the advantage that it has a very low weight and high flexibility, which means that the thermal paste can be applied very easily.
Hydronaut achieves the best values for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easy-to-apply heat transfer medium for demanding users.
Technical Specifications
- Thermal Resistance: 0.0076K/W
- Electrical Conductivity: 0 hp/m
- Viscosity: 140-190 pas
- Density: 2.6g/cm3
- Temperature: -200°C / +350°C
- Contents: 1g
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