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  • Ultra-High Thermal Conductivity
  • Increased Indium Content
  • Optimal Application Through Plastic Needle
  • Density: 6,24g/cm³
  • Application Temperature: 10° C bis 140° C
  • Thermal Conductivity: 73 W/mk
  • Consistency: Liquid
  • Color: Silver
  • Standard Sizes: 1g
  • Possible Thickness: Variable
  • Silicone Based: No
  • Typical Application: For CPUs, GPUs, Notebooks, ICs

2,499.00

Description

Features:

  • Ultra-High Thermal Conductivity
  • Increased Indium Content
  • Optimal Application Through Plastic Needle
  • Density: 6,24g/cm³
  • Application Temperature: 10° C bis 140° C
  • Thermal Conductivity: 73 W/mk
  • Consistency: Liquid
  • Color: Silver
  • Standard Sizes: 1g
  • Possible Thickness: Variable
  • Silicone Based: No
  • Typical Application: For CPUs, GPUs, Notebooks, ICs

Description:

Thermal Grizzly Conductonaut is a high-performance liquid metal thermal compound. The Conductonaut liquid metal thermal paste was developed for applications with a high degree of efficiency. The Conductonaut is recommended as a top product for experienced users who are looking for a solution with the best heat dissipation in a temperature range of over 8 ° C.

Properties:

Thermal Grizzly Conductonaut liquid metal thermal compound is based on a eutectic alloy. A special combination of metals like tin, gallium, and indium results in very high thermal conductivity and excellent long-term stability.

Application:

Thermal Grizzly Conductonaut is recommended for applications that require extremely high thermal conductivity at room temperature – e.g., between a silicon chip PC microprocessor and heat sink. The liquid metal compound compensates for even the slightest irregularities, which cannot be achieved with conventional thermal greases.

Storage:

Thermal Grizzly Conductonaut should be stored boxed and under dry conditions at room temperature.

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